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    DSA00282303.pdf

    • Mitsubishi
    • 2.10 3rd Generation DIP and Mini-DIP-IPM (Dual-in-line Package Intelligent Power Modules) Features: · Employing 5th generation planar IGBT chips with 0.6µm design rule or CSTBTTM technology with
    • Original

    DSA00282303.pdf preview Download Datasheet

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