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    DSA0018781.pdf by Fujitsu

    • BALL GRID ARRAY PACKAGE 416 PIN PLASTIC BGA-416P-M02 Lead pitch 50mil Pin matrix 30 Sealing method Resin seal 416-pin plastic BGA (BGA-416P-M02) 416-pin plastic BGA (BGA-
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    416-PIN BGA-416P BGA-416P-M02
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