DSAH00482089.pdf by Philips Semiconductors

Partial File Text INTEGRATED CIRCUITS ADDENDUM Contactless Single-trip Ticket ICs MF0 IC U10 01 MF0 IC U11 01 Bumped Wafer Specification Product Specification Revision 3.0 PUBLIC March 2003 Philips Semicondu
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ibis format IBIS wafer map format ic u11