The Datasheet Archive
Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers
Search
DSASW00107579.pdf
by Altera
Partial File Text
PROCESS CHANGE NOTIFICATION PCN0516 MOLD COMPOUND CHANGE FOR PBGA PACKAGES Change Description: Altera is adopting Sumitomo G770 series mold compound as the standard mold material on its plastic ba
Datasheet Type
Original
RoHS
Unknown
Pb Free
Unknown
Lifecycle
Unknown
Price & Stock
Find it at Findchips.com
DSASW00107579.pdf
preview
Download Datasheet
User Tagged Keywords
EPF6016B
EPF6024A
EPF8820A
G770 mold compound
G770 sumitomo
G770* G770 mold compound Sumitomo 1000
G770* sumitomo
mold compound high thermal conductivity
pcl 240
PCN0516
plaskon
SUMITOMO
Sumitomo 1000
sumitomo g770
Sumitomo G770 dissipation factor
thermal conductivity of sumitomo g770
Unbiased HAST 130, 85 RH, 100 Hrs
viscosity
Price & Stock Powered by