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    DSASW00107578.pdf

    • Altera
    • PROCESS CHANGE NOTIFICATION PCN0515 MOLD COMPOUND CHANGE FOR FBGA PACKAGES Change Description: Altera is adopting the Sumitomo G770 series mold compound as the standard mold material on Altera® Fi
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    DSASW00107578.pdf preview Download Datasheet

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    altera date code ep20k200 BGA sumitomo ep1k30 pin EPF10K200E EPF10K200S EPF6016A EPM2210 324 EPM3128A EPM3256A EPM7064AE EPM7064B EPM7128A EPM7128AE EPM7128B FBGA400 FBGA672 G770 HC G770 mold compound G770 sumitomo G770* G770 mold compound Sumitomo 1000 G770* sumitomo mold compound MP1K100 MPF10K130E Nitto Nitto HC nitto hc100 PCN0515 SUMITOMO Sumitomo 1000 sumitomo G770 thermal conductivity of sumitomo g770 Unbiased HAST 130, 85 RH, 100 Hrs viscosity
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