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    DSASW00107578.pdf

    • Altera
    • PROCESS CHANGE NOTIFICATION PCN0515 MOLD COMPOUND CHANGE FOR FBGA PACKAGES Change Description: Altera is adopting the Sumitomo G770 series mold compound as the standard mold material on Altera® Fi
    • Original

    DSASW00107578.pdf preview Download Datasheet

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