Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    DSASW00106121.pdf

    • Altera
    • MODELING AND EXPERIMENTAL CORRELATION OF BGA SOLDER JOINTS UNDER PCB BENDING Anurag Bansal, Yuan Li, and Vadali Mahadev Altera Corporation 101 Innovation Drive M/S 4101, San Jose, CA 95134, USA a
    • Original
    • Price & Stock Powered by Findchips

    DSASW00106121.pdf preview Download Datasheet

    Supplyframe Tracking Pixel