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    DSASW00106121.pdf

    • Altera
    • MODELING AND EXPERIMENTAL CORRELATION OF BGA SOLDER JOINTS UNDER PCB BENDING Anurag Bansal, Yuan Li, and Vadali Mahadev Altera Corporation 101 Innovation Drive M/S 4101, San Jose, CA 95134, USA a
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    DSASW00106121.pdf preview Download Datasheet

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