DSASW00106121.pdf by Altera

Partial File Text MODELING AND EXPERIMENTAL CORRELATION OF BGA SOLDER JOINTS UNDER PCB BENDING Anurag Bansal, Yuan Li, and Vadali Mahadev Altera Corporation 101 Innovation Drive M/S 4101, San Jose, CA 95134, USA a
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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