DSASW0014398.pdf by Freescale Semiconductor

Partial File Text Freescale Semiconductor Engineering Bulletin EB635 Rev. 2, 4/2005 Lead-Free BGA Solder Joint Assembly Evaluation To support a cleaner environment, meet market demands, and comply with int
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"BGA Rework Practices", BGA PROFILING EB635 Indalloy 181 Lead Free reflow soldering profile BGA reflow soldering profile BGA Solder Paste, Indium, Type 3 Soldering guidelines

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