DSACRA00005731.pdf
- Xilinx
- 100% Material Declaration Data Sheet FF1924 PK482 (v1.1) September 28, 2012 Average Weight: 28.3806 g Component Silicon Die (FPGA) Solder Bump Tin (Sn) Lead (Pb) Die Underfill Bisphenol F-type li
- Original
-
Price & Stock Powered by
Findchips
