DSA00391789.pdf by KOA Speer Electronics

Partial File Text NETWORKS TECHNOLOGY OF TOMORROW THICK FILM R-C NETWORKS CUSTOMIZED CIRCUITS CR SERIES STRUCTURE 1 2 3 4 5 6 7 8 9 Ceramic substrate Pin connection Printed conductor (Ag, Pd) Resistive layer G
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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