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DSACRA000020135.pdf
Manufacturer
HOLT Integrated Circuits
Partial File Text
Assembly Location and Mold Compound Change for QFN Packages Product Change Notice Overview This notice describes two changes to the ARINC 429 and MIL-STD 1553 family of devices which are manufacture
Datasheet Type
Original
ECAD Model
Part Details
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7470-LA
G770* sumitomo
G770H
GE mold compound
GE-74
GE-7470L-A
HI-1573PCIF
HI-1579PCI
HI-3582PCI-10
mold compound
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nitto GE
sumitomo g770h
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