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    DSA00269397.pdf

    • Central Semiconductor
    • PROCESS CPZ25 Zener Diodes 1.5 W Zener Diode Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 33.5 X 33.5 MILS Die Thickness 8.0 MILS Anode Bonding Pad Area 23
    • Original
    • Part pricing, stock, data attributes from Findchips.com

    DSA00269397.pdf preview Download Datasheet

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    1N5913 1N5913B 1N5956B CPZ25 on chip zener zener diode chip zener wafer Zener-Diode
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