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    DSA00269329.pdf

    • Central Semiconductor
    • Central TM PROCESS CPQ130 Triac Semiconductor Corp. 12 Amp, 600 Volt Triac Chip PROCESS DETAILS Process GLASS PASSIVATED MESA Die Size 130 MILS x 130 MILS Die Thickness
    • Original
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    DSA00269329.pdf preview Download Datasheet

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