This site uses third-party website tracking technologies to provide and continually improve our services, and to display advertisements according to users' interests. I agree and may revoke or change my consent at any time with effect for the future.
PROCESS
CPQ057
TRIAC
2.0 Amp, 600 Volt TRIAC Chip
PROCESS DETAILS
Process
Glass Passivated Mesa
Die Size
57 x 57 MILS
Die Thickness
8.6 MILS ± 0.6 MILS
MT1 Bonding Pad Are
Findchips