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    DSA00269326.pdf

    • Central Semiconductor
    • PROCESS CPQ057 TRIAC 2.0 Amp, 600 Volt TRIAC Chip PROCESS DETAILS Process Glass Passivated Mesa Die Size 57 x 57 MILS Die Thickness 8.6 MILS ± 0.6 MILS MT1 Bonding Pad Are
    • Original
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    DSA00269326.pdf preview Download Datasheet

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