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DSA00269326.pdf
Manufacturer
Central Semiconductor
Partial File Text
PROCESS CPQ057 TRIAC 2.0 Amp, 600 Volt TRIAC Chip PROCESS DETAILS Process Glass Passivated Mesa Die Size 57 x 57 MILS Die Thickness 8.6 MILS ± 0.6 MILS MT1 Bonding Pad Are
Datasheet Type
Original
ECAD Model
Part Details
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DSA00269326.pdf preview
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6 amp 600 volt triac
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