DASF0023815.pdf by Keystone Electronics

Partial File Text M55-S-NPS Final 10-08:M55 -NPS final revise 8-08 11/20/08 9:23 AM Page 4 MICRO JACKS MICRO PINS · Space saving design for high density packaging · Beryllium Copper multi-spring contac
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Active
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ASTM-B16 MIL-T-10727 multispring

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