DSA00508995.pdf by STATS ChipPAC

Partial File Text QFP-SD Stacked Die Quad Flat Pack · Stacking of die enables more functionality and integration in a conventional QFP package FEATURES DESCRIPTION · Combining devices into one package red
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32 QFP PACKAGE thermal resistance 64 leads qfp AN 7823 EP 603 LQFP Package LQFP Package tray QFP JEDEC tray STATS ChipPAC Techpoint