DSADA0023350.pdf by Philips Semiconductors

Partial File Text PDF: 2003 Nov 21 Philips Semiconductors Package outline HBGA672: plastic thermal enhanced ball grid array package; 672 balls; body 40 x 40 x 1.2 mm; heatsink B D SOT835-1 A ball
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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