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DSADA0023325.pdf
Manufacturer
Philips Semiconductors
Partial File Text
PDF: 2003 May 20 Philips Semiconductors Package outline BGA288: plastic ball grid array package; 288 balls; body 23 x 23 x 1.7 mm SOT812-1 B D D1 A ball A1 index area A2 A
Datasheet Type
Original
ECAD Model
Part Details
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User Tagged Keywords
BGA288
MS-034
sot812
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