DSADA0023324.pdf by Philips Semiconductors

Partial File Text PDF: 2003 Apr 17 Philips Semiconductors Package outline BGA256: plastic ball grid array package; 256 balls; body 17 x 17 x 1.2 mm SOT811-1 B D D1 A ball A1 index area A
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BGA-256 BGA256 BGA256 17 BGA256 17 X 17 MS-034 sot811