DSADA0023318.pdf by Philips Semiconductors

Partial File Text PDF: 2003 Mar 27 Philips Semiconductors Package outline HVQFN64: plastic thermal enhanced very thin quad flat package; no leads; 64 terminals; body 9 x 9 x 0.85 mm SOT804-1 B D D1
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
Price & Stock
Powered by Findchips

DSADA0023318.pdf preview

Download Datasheet

User Tagged Keywords

HVQFN64 jedec package MO-220 64 MO-220 sot804