DSADA0023207.pdf by Philips Semiconductors

Partial File Text PDF: 2002 May 07 Philips Semiconductors Package outline HBGA960: plastic thermal enhanced ball grid array package; 960 balls; body 33 x 33 x 2.4 mm; heatsink B D SOT683-1 A ball
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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