DSADA0023167.pdf by Philips Semiconductors

Partial File Text PDF: 2003 Jan 29 Philips Semiconductors Package outline HBGA1312: plastic thermal enhanced ball grid array package; 1312 balls; body 40 x 40 x 1.65 mm; heatsink B D SOT624-1 A b
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
Price & Stock Find it at Findchips.com

DSADA0023167.pdf preview

Download Datasheet

User Tagged Keywords

HBGA1312 MS-034

Price & Stock Powered by