DSAASSA0009124.pdf by NXP Semiconductors

Partial File Text NXP SOD882D package with reduced height and innovative pad design First leadless package with tin-plated, solderable side pads This new, ultra-small leadless plastic package is the industry's firs
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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infocus shear force SOD882 SOD882D

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