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DSA0026741.pdf
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Intersil
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Thermal Characterization and Board Level Modeling of the RSLIC18 in the MLFP Package TM Application Note October 2001 AN9922 Author: Doug Bruss Introduction In most circuit designs r
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Original
ECAD Model
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User Tagged Keywords
an9922
JESD51-3
JESD51-5
JESD51-7
mlf 0.3mm pitch
MO220
TB379