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    DSASW00135382.pdf

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    • PROCESS CP208 Power Transistor NPN - Amp/Switch Transistor Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 66 x 66 MILS Die Thickness 12.5 ± 1.0 MILS Base Bonding
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    DSASW00135382.pdf preview Download Datasheet

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    CJD31C cp208 MJE182 TIP31C transistor CR NPN

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