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    DSADA0023356.pdf

    • Philips Semiconductors
    • Package outline Philips Semiconductors HTQFP80: plastic thermal enhanced thin quad flat package; 80 leads; body 12 x 12 x 1 mm; exposed die pad SOT841-2 c y exposed die pad X Dh
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    DSADA0023356.pdf preview Download Datasheet

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    HTQFP80 jedec ms-026 MS-026 sot841
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