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    DSAZSAA00019829.pdf

    • NXP Semiconductors
    • Package outline BGA376: plastic ball grid array package; 376 balls; body 23 x 23 x 1.75 mm SOT741-1 B D A D1 ball A1 index area A A2 A1 E1 E detail X C e1 b 1/2 e
    • Original
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