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DSA0037431.pdf
Manufacturer
Mitsubishi
Partial File Text
MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGE THERMAL RESISTANCE 5. PACKAGE THERMAL RESISTANCE 5.1 EQUIVALENT THERMAL CIRCUIT The power dissipation of many ICs is, on a par with that of small-s
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Original
ECAD Model
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ic and equivalent
QFP PACKAGE thermal resistance
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