Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    DSA00455871.pdf

    • Central Semiconductor
    • PROCESS CP311 Power Transistor NPN High Voltage Transistor Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 109.5 x 109.5 MILS Die Thickness 9.0 MILS Base Bonding
    • Original
    • Price & Stock Powered by Findchips

    DSA00455871.pdf preview Download Datasheet

    User Tagged Keywords

    CJDD3110 CP311

    Newly Added Datasheets | Privacy Policy | Digital Services Act | Contact Us | About Us

    Copyright © 2024.

    Supplyframe Tracking Pixel