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DSA0037397.pdf
Manufacturer
Mitsubishi
Partial File Text
MITSUBISHI INTEGRATED CIRCUIT PACKAGES SURFACE MOUNTING PROCESS 2.2 PRINTED CIRCUIT BOARD DESIGN In surface mounting, mount pad designing and board material selection are critical. Mount pad desi
Datasheet Type
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ECAD Model
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detail in table SURFACE MOUNT COMPONENTS
MITSUBISHI INTEGRATED CIRCUIT PACKAGES reflow
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