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DSA00455882.pdf
Manufacturer
Central Semiconductor
Partial File Text
PROCESS CP710 Small Signal Transistors PNP - High VoltageTransistor Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 26 x 26 MILS Die Thickness 9.0 MILS Base Bondi
Type
Original
ECAD Model
Part Details
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DSA00455882.pdf preview
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CMPTA94
CP710
CXTA94
CZTA94
MPSA94
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