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DSA00156664.pdf
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Cypress Semiconductor Qualification Report QTP# 98422 VERSION 1.0 May, 1999 Nitto MP-8000 Molding Compound 160 Ld Plastic Quad Flat Pack (PQFP) (CY7C611) Asat, Hong Kong Assembly CYPRESS
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ECAD Model
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84-1lmis
84-1LMISR4
CY7C611
JEDEC-22
JEDEC22
MOLDING MATERIAL MP8000
MP-8000
mp8000
Nitto
Nitto MP 8000
Nitto MP8000
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