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DSA0061108.pdf
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Partial File Text
NEW PRODUCTS 7 LATEST TECHNOLOGICAL TRENDS IN VLSI PACKAGES AND DEVELOPMENT OF NEW PACKAGES Hisao Kasuga/Miwa Momma Introduction Consumers expect constant progress in electronic systems and
Datasheet Type
Original
ECAD Model
DSA0061108.pdf preview
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User Tagged Keywords
35 x 35 PBGA, 580 100 balls
BGA Ball Crack
BGA PACKAGE thermal resistance
of BGA Staggered pins
of BGA Staggered Pins package
without underfill