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    DSAFRAZ0015624.pdf

    • National Semiconductor
    • Packaging/CSP Wireless: Product Overview Page 1 August 1998 Substrate CSP Top View · 68% Board Area Reduction (vs. TSSOP 20) ­ Only 25% larger than die · Standard SMT Process · JEDE
    • Original
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    DSAFRAZ0015624.pdf preview Download Datasheet

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    CSP28 LMX2324 LMX2330L LMX2330LSLBX PCB design for csp package PSR-4000-AUS5 PSR4000-AUS5 TSSOP 16l Package
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