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DSAZIHA100084795.pdf
Manufacturer
Central Semiconductor
Partial File Text
PROCESS CP608 Power Transistor PNP - Amp/Switch Transistor Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 66 x 66 MILS Die Thickness 12.5 ± 1.0 MILS Base Bonding
Type
Original
ECAD Model
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