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DASF005098.pdf
Manufacturer
Maxim Integrated Products
Partial File Text
Maxim > App Notes > GENERAL ENGINEERING TOPICS PROTOTYPING AND PC BOARD LAYOUT Keywords: Wafer Level Package, WLP, Flip Chip, Flip-Chip, CSP, Chip Scale Package, PCB Assembly, PCBA, Die Product,
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ECAD Model
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User Tagged Keywords
copper alloys physical properties
csp process flow diagram
die tilt
DS1804
DS1845
DS2401
DS2406
DS2761X
EIA-746
FR4 height thickness substrate
FR4 substrate height and thickness
IPC-6012
IPC-6012A
IPC-7525
IPC-A-600
J-STD-004
J-STD-004 paste
J-STD-004 sn63pb37
MAXIM Assembly Locations OF CODE
Pb95Sn5
pcb warpage in ipc standard
ROSIN FLUX TYPE ROL0
sn96.5ag3.5
underfill dispense needle