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    DSAZSAA00018919.pdf

    • NXP Semiconductors
    • Package outline DBSMS27P: plastic dual bent surface mounted SIL power package; 27 leads SOT1154-1 L4 L3 θ2 gauge plane seating plane A3 S R 1 R 2 D y Lp1 θ1 L
    • Original
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    DSAZSAA00018919.pdf preview Download Datasheet

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