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    SG-BGA-6076 datasheet

    • Ironwood Electronics
    • GHz BGA Sockets-0.8mm; IC Size X (mm): 9; IC Size Y (mm): 6; IC Array X: 8; IC Array Y: 6; Max Pincount: 48; Top Pitch (mm): 0.8; IC Ball Coplanarity (mm): 0.08; IC Ball Diameter Max (mm): 0.35; IC Ball Height Max (mm): 0.28; IC Ball Height Min (mm): 0.2; IC Size Tolerance (mm): 0.2; IC Total Height Max (mm): 1.2; Max Package Code: Backing Plate: no; Cavity Down: no; Heat Sink: no; IC Top Surface: Flat; Socket Lid: Swivel; Part Description: GHz BGA Socket (ZIF)-HD
    • Original
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    SG-BGA-6076 datasheet preview Download Datasheet

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