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DSA007612.pdf
Manufacturer
Alpha & Omega Semiconductor
Partial File Text
Document No. DSMT-0002 Rev. 1 Page: 1/1 PCB Land Design and Surface Mount for DFN2x5 Punched Package Introduction DFN package is a plastic encapsulated package with a copper lead frame substr
Datasheet Type
Original
ECAD Model
Part Details
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alpha solder paste PROFILE
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