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    DSASW00135433.pdf

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    • PROCESS CP782X Small Signal Transistor PNP - Low VCE(SAT) Transistor Chip PROCESS DETAILS Die Size 26 x 26 MILS Die Thickness 5.9 MILS Base Bonding Pad Area 5.5 x 5.5 MILS
    • Original

    DSASW00135433.pdf preview Download Datasheet

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