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    DSAZSAA00019108.pdf

    • NXP Semiconductors
    • Package outline TSSOP30: plastic thin shrink small outline package; 30 leads; body width 4.4 mm; lead pitch 0.5 mm SOT607-1 E D A X c HE y v M A Z 16 30 A2 pin
    • Original
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    DSAZSAA00019108.pdf preview Download Datasheet

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