Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    DASF0026143.pdf

    • Maxim Integrated Products
    • Application Note: HFAN-08.1 Rev.1; 04/08 Thermal Considerations of QFN and Other Exposed-Paddle Packages Note: This application note is a summary and compilation of information based on the
    • Original
    • Part pricing, stock, data attributes from Findchips.com

    DASF0026143.pdf preview Download Datasheet

    User Tagged Keywords

    "thermal via" Amkor Electronics Amkor Technology 1999 AN569 HFAN-08-1 JESD51-1 JESD51-2 JESD51-3 JESD51-4 QFN PACKAGE Junction to PCB thermal resistance SLMA002 thermal analysis on pcb
    Price & Stock Powered by Findchips

    Newly Added Datasheets | Privacy Policy | Digital Services Act | Contact Us | About Us

    Copyright © 2024.

    Supplyframe Tracking Pixel