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    DSAZSAA00019012.pdf

    • NXP Semiconductors
    • Package outline RDBS13P: plastic rectangular-DIL-bent-SIL (reverse bent) power package; 13 leads non-concave SOT462-2 Dh x D Eh view B: mounting base side A2 d B j E
    • Original
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    DSAZSAA00019012.pdf preview Download Datasheet

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