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DSAH00216725.pdf
Manufacturer
IXYS
Partial File Text
Assembly Instructions MOS/IGBT Chips Recommended Solder System IXYS recommends a soft solder chip attach using a solder composition of 92.5 % Pb, 5 % Sn and 2.5 % Ag. The maximum chip attach tempe
Datasheet Type
Original
ECAD Model
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