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    DSADA0023042.pdf

    • Philips Semiconductors
    • PDF: 2003 Jan 23 Philips Semiconductors Package outline BGA292: plastic ball grid array package; 292 balls; body 27 x 27 x 1.75 mm SOT489-1 B D A D1 ball A1 index area A
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    BGA-292 BGA292 C BGA292 MS-034

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