Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    DSAUD0048354.pdf

    • Bergquist
    • Gap Pad VO Soft ® Highly Conformable,Thermally Conductive Material for Filling Air Gaps Features and Benefits TYPICAL PROPERTIES OF GAP PAD VO SOFT · Thermal conductivity: 0.8 W/m-K · Co
    • Original
    • Price & Stock Powered by Findchips

    DSAUD0048354.pdf preview Download Datasheet

    User Tagged Keywords

    ACME10256 ASTM D374 D2240 SIL-PAD density
    Supplyframe Tracking Pixel