The Datasheet Archive
Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers
Search
DSASW00198778.pdf
Manufacturer
Intersil
Partial File Text
Thermal Via Note: PCA 40 QFN 5X5 NDG 40 package QFN EXPOSED DIE PAD DIMENSIONS = 3.7 mm +- 0.10 mm QFN I/0 PAD LENGTH =0.4+-0.10 mm max QFN I/0 PAD WIDTH =0.15 mm min 0.20 mm typ 0.25 mm max
Datasheet Type
Original
ECAD Model
Part Details
Part pricing, stock, data attributes from Findchips.com
DSASW00198778.pdf preview
Download Datasheet
User Tagged Keywords
"exposed pad" PCB via
"thermal via"
40-QFN
P4171
QFN "exposed die"
QFN 5x5
qfn 5X5 land pattern
qfn stencil
solder mask
via diameter pitch
X-RAY INSPECTION
Price & Stock Powered by
Findchips