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    DSAZSAA00019082.pdf

    • NXP Semiconductors
    • Package outline Leadless surface-mounted package; plastic cap; 8 terminations b1 (8×) e ZD (2×) 1 (6×) 2 Z5 (2×) b (8×) 3 SOT567A Z1 (6×) 1 4 2 Z3 (35×)
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